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Interplay of Precursor and Plasma for The Deposition of HfO 2 via PEALD: Film Growth and Dielectric...

Interplay of Precursor and Plasma for The Deposition of HfO 2 via PEALD: Film Growth and Dielectric...

https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_crossref_citationtrail_10_1002_admi_202300244

Interplay of Precursor and Plasma for The Deposition of HfO 2 via PEALD: Film Growth and Dielectric Properties

About this item

Full title

Interplay of Precursor and Plasma for The Deposition of HfO 2 via PEALD: Film Growth and Dielectric Properties

Journal title

Advanced materials interfaces, 2023-10, Vol.10 (28)

Language

English

Formats

More information

Scope and Contents

Contents

HfO
2
thin films are appealing for microelectronic applications such as high‐
κ
dielectric layers, memristors, and ferroelectric memory devices. To fulfill the different requirements of each application, the properties of the deposited material need to be tuned accordingly. In this context, plasma‐enhanced atomic layer deposition (PEALD...

Alternative Titles

Full title

Interplay of Precursor and Plasma for The Deposition of HfO 2 via PEALD: Film Growth and Dielectric Properties

Identifiers

Primary Identifiers

Record Identifier

TN_cdi_crossref_citationtrail_10_1002_admi_202300244

Permalink

https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_crossref_citationtrail_10_1002_admi_202300244

Other Identifiers

ISSN

2196-7350

E-ISSN

2196-7350

DOI

10.1002/admi.202300244

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