Fabrication and surface treatment of fine copper lines for HDI printed circuit board with modified f...
Fabrication and surface treatment of fine copper lines for HDI printed circuit board with modified full-additive method
About this item
Full title
Author / Creator
Publisher
Bradford: Emerald Publishing Limited
Journal title
Language
English
Formats
Publication information
Publisher
Bradford: Emerald Publishing Limited
Subjects
More information
Scope and Contents
Contents
Purpose
This paper aims to propose a modified full-additive method (MFAM) to fabricate fine copper lines for high density interconnection (HDI) printed circuit boards (PCBs). In addition, the surface of the fine copper lines is treated with a brown oxidation process to obtain good adhesion between the copper and the dielectric resin.
Design/m...
Alternative Titles
Full title
Fabrication and surface treatment of fine copper lines for HDI printed circuit board with modified full-additive method
Authors, Artists and Contributors
Identifiers
Primary Identifiers
Record Identifier
TN_cdi_crossref_primary_10_1108_CW_02_2017_0004
Permalink
https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_crossref_primary_10_1108_CW_02_2017_0004
Other Identifiers
ISSN
0305-6120
E-ISSN
1758-602X
DOI
10.1108/CW-02-2017-0004
