Thermomechanical fatigue lifetime evaluation of solder joints in power semiconductors using a novel...
Thermomechanical fatigue lifetime evaluation of solder joints in power semiconductors using a novel energy based modeling
About this item
Full title
Author / Creator
Publisher
Bradford: Emerald Publishing Limited
Journal title
Language
English
Formats
Publication information
Publisher
Bradford: Emerald Publishing Limited
Subjects
More information
Scope and Contents
Contents
Purpose
This paper aims to establish a more accurate model for lifetime estimation.
Design/methodology/approach
Finite element model simulation and experimental tests are used to enhance the lifetime prediction model of the solder joint.
Findings
A more precise model was found.
Originality/value
It is confirmed that the paper i...
Alternative Titles
Full title
Thermomechanical fatigue lifetime evaluation of solder joints in power semiconductors using a novel energy based modeling
Authors, Artists and Contributors
Identifiers
Primary Identifiers
Record Identifier
TN_cdi_crossref_primary_10_1108_SSMT_06_2020_0028
Permalink
https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_crossref_primary_10_1108_SSMT_06_2020_0028
Other Identifiers
ISSN
0954-0911
E-ISSN
1758-6836
DOI
10.1108/SSMT-06-2020-0028
