The Effect of Bi and Zn Additives on Sn-Ag-Cu Lead-Free Solder Alloys for Ag Reduction
The Effect of Bi and Zn Additives on Sn-Ag-Cu Lead-Free Solder Alloys for Ag Reduction
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Basel: MDPI AG
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Language
English
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Publisher
Basel: MDPI AG
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This study aimed to investigate the effects of the addition of Bi and Zn on the mechanical properties of Sn-Ag-Cu lead-free alloy frequently used as a soldering material in the semiconductor packaging process. To reduce the Ag content of the commercial alloy SAC305 (Sn-3Ag-0.5Cu) by 1 wt.%, Bi and Zn were admixed in different ratios and the changes...
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Full title
The Effect of Bi and Zn Additives on Sn-Ag-Cu Lead-Free Solder Alloys for Ag Reduction
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TN_cdi_doaj_primary_oai_doaj_org_article_0fe389bcee354df9b0d60f6f9b812103
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https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_doaj_primary_oai_doaj_org_article_0fe389bcee354df9b0d60f6f9b812103
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ISSN
2075-4701
E-ISSN
2075-4701
DOI
10.3390/met12081245
