Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bo...
Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration
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Publisher
Basel: MDPI AG
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Language
English
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Publisher
Basel: MDPI AG
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Contents
New surface mounting and packaging technologies, using self-assembly with chips having cavity structures, were investigated for three-dimensional (3D) and hetero integration of complementary metal-oxide semiconductors (CMOS) and microelectromechanical systems (MEMS). By the surface tension of small droplets of 0.5 wt% hydrogen fluoride (HF) aqueous...
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Full title
Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration
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TN_cdi_doaj_primary_oai_doaj_org_article_10c02fb35a6741929a80a503ca7fc64d
Permalink
https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_doaj_primary_oai_doaj_org_article_10c02fb35a6741929a80a503ca7fc64d
Other Identifiers
ISSN
2072-666X
E-ISSN
2072-666X
DOI
10.3390/mi2010049
