Study on Electromigration Effects and IMC Formation on Cu–Sn Films Due to Current Stress and Tempera...
Study on Electromigration Effects and IMC Formation on Cu–Sn Films Due to Current Stress and Temperature
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Basel: MDPI AG
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Language
English
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Basel: MDPI AG
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In this study, the effects of electromigration on a solder/copper substrate due to temperature and current density stress were investigated. The copper–tin (Cu–Sn) film samples were subjected under a fixed current and various heating conditions (130 °C and 180 °C) and current densities (different cross-sectional areas). The micro-structural changes...
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Full title
Study on Electromigration Effects and IMC Formation on Cu–Sn Films Due to Current Stress and Temperature
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TN_cdi_doaj_primary_oai_doaj_org_article_17f7b28fe0124018b788f6a3f161f8e0
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https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_doaj_primary_oai_doaj_org_article_17f7b28fe0124018b788f6a3f161f8e0
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ISSN
2076-3417
E-ISSN
2076-3417
DOI
10.3390/app10248893
