Characterization of Residual Stress in SOI Wafers by Using MEMS Cantilever Beams
Characterization of Residual Stress in SOI Wafers by Using MEMS Cantilever Beams
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Author / Creator
Yang, Haotian , Liu, Min , Zhu, Yingmin , Wang, Weidong , Qin, Xianming , He, Lilong and Jiang, Kyle
Publisher
Basel: MDPI AG
Journal title
Language
English
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Publication information
Publisher
Basel: MDPI AG
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Scope and Contents
Contents
Silicon-on-insulator (SOI) wafers are crucial raw materials in the manufacturing process of microelectromechanical systems (MEMS). Residual stresses generated inside the wafers during the fabrication process can seriously affect the performance, reliability, and yield of MEMS devices. In this paper, a low-cost method based on mechanical modeling is...
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Full title
Characterization of Residual Stress in SOI Wafers by Using MEMS Cantilever Beams
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Author / Creator
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Record Identifier
TN_cdi_doaj_primary_oai_doaj_org_article_183a56f464a4499ba76974788db2bf68
Permalink
https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_doaj_primary_oai_doaj_org_article_183a56f464a4499ba76974788db2bf68
Other Identifiers
ISSN
2072-666X
E-ISSN
2072-666X
DOI
10.3390/mi14081510
