An Automated Room Temperature Flip-Chip Mounting Process for Hybrid Printed Electronics
An Automated Room Temperature Flip-Chip Mounting Process for Hybrid Printed Electronics
About this item
Full title
Author / Creator
Publisher
Switzerland: MDPI AG
Journal title
Language
English
Formats
Publication information
Publisher
Switzerland: MDPI AG
Subjects
More information
Scope and Contents
Contents
Printing technology and mounting technology enable the novel field of hybrid printed electronics. To establish a hybrid printed system, one challenge is that the applied mounting process meets the requirements of functional inks and substrates. One of the most common requirements is low process temperature. Many functional inks and substrates canno...
Alternative Titles
Full title
An Automated Room Temperature Flip-Chip Mounting Process for Hybrid Printed Electronics
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Record Identifier
TN_cdi_doaj_primary_oai_doaj_org_article_2e35b073a63948b5948200cbedf41493
Permalink
https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_doaj_primary_oai_doaj_org_article_2e35b073a63948b5948200cbedf41493
Other Identifiers
ISSN
2072-666X
E-ISSN
2072-666X
DOI
10.3390/mi13040583
