Single‐Crystal and Polycrystal SiC Bonding for Cost‐effective Chip Fabrication
Single‐Crystal and Polycrystal SiC Bonding for Cost‐effective Chip Fabrication
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Publisher
Weinheim: John Wiley & Sons, Inc
Journal title
Language
English
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Publisher
Weinheim: John Wiley & Sons, Inc
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Contents
High‐quantity single‐crystal silicon carbide (SiC) is widely used in power electronics due to its excellent breakdown electric field strength and high thermal conductivity. However, back grinding during the chip fabrication generally results in ≈70% of single‐crystal SiC being wasted, leading to the high cost of SiC chips. In order to improve the u...
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Full title
Single‐Crystal and Polycrystal SiC Bonding for Cost‐effective Chip Fabrication
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Author / Creator
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TN_cdi_doaj_primary_oai_doaj_org_article_3fe96322a55047109ca4cf08a6c17954
Permalink
https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_doaj_primary_oai_doaj_org_article_3fe96322a55047109ca4cf08a6c17954
Other Identifiers
ISSN
2196-7350
E-ISSN
2196-7350
DOI
10.1002/admi.202400816
