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Integration of a (–Cu–S–)n plane in a metal–organic framework affords high electrical conductivity

Integration of a (–Cu–S–)n plane in a metal–organic framework affords high electrical conductivity

https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_doaj_primary_oai_doaj_org_article_47c8b8f10d9a4bfcbc12dd4f44f05830

Integration of a (–Cu–S–)n plane in a metal–organic framework affords high electrical conductivity

About this item

Full title

Integration of a (–Cu–S–)n plane in a metal–organic framework affords high electrical conductivity

Publisher

London: Nature Publishing Group UK

Journal title

Nature communications, 2019-04, Vol.10 (1), p.1721-1721, Article 1721

Language

English

Formats

Publication information

Publisher

London: Nature Publishing Group UK

More information

Scope and Contents

Contents

Designing highly conducting metal–organic frameworks (MOFs) is currently a subject of great interest for their potential applications in diverse areas encompassing energy storage and generation. Herein, a strategic design in which a metal–sulfur plane is integrated within a MOF to achieve high electrical conductivity, is successfully demonstrated....

Alternative Titles

Full title

Integration of a (–Cu–S–)n plane in a metal–organic framework affords high electrical conductivity

Identifiers

Primary Identifiers

Record Identifier

TN_cdi_doaj_primary_oai_doaj_org_article_47c8b8f10d9a4bfcbc12dd4f44f05830

Permalink

https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_doaj_primary_oai_doaj_org_article_47c8b8f10d9a4bfcbc12dd4f44f05830

Other Identifiers

ISSN

2041-1723

E-ISSN

2041-1723

DOI

10.1038/s41467-019-09682-0

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