Post-Processing Trimming of Silicon Photonic Devices Using Femtosecond Laser
Post-Processing Trimming of Silicon Photonic Devices Using Femtosecond Laser
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Publisher
Switzerland: MDPI AG
Journal title
Language
English
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Publisher
Switzerland: MDPI AG
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Scope and Contents
Contents
Fabrication errors inevitably occur in device manufacturing owing to the limited processing accuracy of commercial silicon photonic processes. For silicon photonic devices, which are mostly processing-sensitive, their performances usually deteriorate significantly. This remains an unsolved issue for mass production, particularly for passive devices...
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Full title
Post-Processing Trimming of Silicon Photonic Devices Using Femtosecond Laser
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TN_cdi_doaj_primary_oai_doaj_org_article_5ce60b5804a2486bb5bec4ef674bcd9b
Permalink
https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_doaj_primary_oai_doaj_org_article_5ce60b5804a2486bb5bec4ef674bcd9b
Other Identifiers
ISSN
2079-4991
E-ISSN
2079-4991
DOI
10.3390/nano13061031
