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One-Dimensional Thermal Analysis of the Flexible Electronic Devices Integrated with Human Skin

One-Dimensional Thermal Analysis of the Flexible Electronic Devices Integrated with Human Skin

https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_doaj_primary_oai_doaj_org_article_6238a0cdee6044eaa5f194d813d03136

One-Dimensional Thermal Analysis of the Flexible Electronic Devices Integrated with Human Skin

About this item

Full title

One-Dimensional Thermal Analysis of the Flexible Electronic Devices Integrated with Human Skin

Publisher

Switzerland: MDPI AG

Journal title

Micromachines (Basel), 2016-11, Vol.7 (11), p.210-210

Language

English

Formats

Publication information

Publisher

Switzerland: MDPI AG

More information

Scope and Contents

Contents

A one-dimensional analytic thermal model for the flexible electronic devices integrated with human skin under a constant and pulsed power is developed. The Fourier heat conduction equation is adopted for the flexible electronics devices while the Pennes bio-heat transfer equation is adopted for the skin tissue. Finite element analysis is performed...

Alternative Titles

Full title

One-Dimensional Thermal Analysis of the Flexible Electronic Devices Integrated with Human Skin

Authors, Artists and Contributors

Identifiers

Primary Identifiers

Record Identifier

TN_cdi_doaj_primary_oai_doaj_org_article_6238a0cdee6044eaa5f194d813d03136

Permalink

https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_doaj_primary_oai_doaj_org_article_6238a0cdee6044eaa5f194d813d03136

Other Identifiers

ISSN

2072-666X

E-ISSN

2072-666X

DOI

10.3390/mi7110210

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