Recent Advances on Thermal Management of Flexible Inorganic Electronics
Recent Advances on Thermal Management of Flexible Inorganic Electronics
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Publisher
Switzerland: MDPI AG
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Language
English
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Publisher
Switzerland: MDPI AG
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Scope and Contents
Contents
Flexible inorganic electronic devices (FIEDs) consisting of functional inorganic components on a soft polymer substrate have enabled many novel applications such as epidermal electronics and wearable electronics, which cannot be realized through conventional rigid electronics. The low thermal dissipation capacity of the soft polymer substrate of FI...
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Full title
Recent Advances on Thermal Management of Flexible Inorganic Electronics
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Record Identifier
TN_cdi_doaj_primary_oai_doaj_org_article_767e502c1e204d9698d417ae97001c13
Permalink
https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_doaj_primary_oai_doaj_org_article_767e502c1e204d9698d417ae97001c13
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ISSN
2072-666X
E-ISSN
2072-666X
DOI
10.3390/mi11040390
