Thermal Analysis on Active Heat Dissipation Design with Embedded Flow Channels for Flexible Electron...
Thermal Analysis on Active Heat Dissipation Design with Embedded Flow Channels for Flexible Electronic Devices
About this item
Full title
Author / Creator
Yu, Yanan , Yin, Yafei , Li, Yuhang , Li, Min and Song, Jizhou
Publisher
Basel: MDPI AG
Journal title
Language
English
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Publication information
Publisher
Basel: MDPI AG
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Scope and Contents
Contents
Heat generation is a major issue in all electronics, as heat reduces product life, reliability, and performance, especially in flexible electronics with low thermal-conductivity polymeric substrates. In this sense, the active heat dissipation design with flow channels holds great promise. Here, a theoretical model, validated by finite element analy...
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Full title
Thermal Analysis on Active Heat Dissipation Design with Embedded Flow Channels for Flexible Electronic Devices
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Author / Creator
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Record Identifier
TN_cdi_doaj_primary_oai_doaj_org_article_928d00a8bc0b4351b81afbf8c9a14eec
Permalink
https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_doaj_primary_oai_doaj_org_article_928d00a8bc0b4351b81afbf8c9a14eec
Other Identifiers
ISSN
2072-666X
E-ISSN
2072-666X
DOI
10.3390/mi12101165
