High-Temperature Failure Evolution Analysis of K-Type Film Thermocouples
High-Temperature Failure Evolution Analysis of K-Type Film Thermocouples
About this item
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Author / Creator
Ruan, Yong , Li, Jiaheng , Xiao, Qian , Wu, Yu and Shi, Meng
Publisher
Basel: MDPI AG
Journal title
Language
English
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Publisher
Basel: MDPI AG
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Scope and Contents
Contents
Ni90%Cr10% and Ni97%Si3% thin-film thermocouples (TFTCs) were fabricated on a silicon substrate using magnetron sputtering technology. Static calibration yielded a Seebeck coefficient of 23.00 μV/°C. During staged temperature elevation of the TFTCs while continuously monitoring their thermoelectric output, a rapid decline in thermoelectric potentia...
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Full title
High-Temperature Failure Evolution Analysis of K-Type Film Thermocouples
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Author / Creator
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Record Identifier
TN_cdi_doaj_primary_oai_doaj_org_article_aea6eb7bcb0145b28c293385ea7d6f30
Permalink
https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_doaj_primary_oai_doaj_org_article_aea6eb7bcb0145b28c293385ea7d6f30
Other Identifiers
ISSN
2072-666X
E-ISSN
2072-666X
DOI
10.3390/mi14112070
