Output Properties of Transparent Submount Packaged FlipChip Light-Emitting Diode Modules
Output Properties of Transparent Submount Packaged FlipChip Light-Emitting Diode Modules
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Author / Creator
Publisher
MDPI AG
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Language
English
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Publisher
MDPI AG
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Contents
Flip chip technology has been widely adopted in modern power light-emitting diode (LED) fabrications and its output efficiency is closely related to the submount material properties. Here, we present the electrical, optical and thermal properties of flip chip light-emitting diodes mounted on transparent sapphire and borosilicate glass which have sh...
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Output Properties of Transparent Submount Packaged FlipChip Light-Emitting Diode Modules
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TN_cdi_doaj_primary_oai_doaj_org_article_c865d87fc7b3402082088ceb432db6ee
Permalink
https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_doaj_primary_oai_doaj_org_article_c865d87fc7b3402082088ceb432db6ee
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ISSN
2076-3417
E-ISSN
2076-3417
DOI
10.3390/app6060179
