Modification of the Cu/W Interface Cohesion by Segregation
Modification of the Cu/W Interface Cohesion by Segregation
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Publisher
Basel: MDPI AG
Journal title
Language
English
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Publisher
Basel: MDPI AG
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Scope and Contents
Contents
Cu/W composites are widely used in various industrial fields as they show thermomechanical properties suitable for a wide range of applications. Additionally, in semiconductor products, WTi in contact with Cu acts as a barrier material between Cu and Si/SiO2. Therefore, the bonding behavior of both Cu/W and Cu/WTi is of great economical interest, a...
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Full title
Modification of the Cu/W Interface Cohesion by Segregation
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TN_cdi_doaj_primary_oai_doaj_org_article_cb3cac8df0c84e80b32ffb7150338bff
Permalink
https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_doaj_primary_oai_doaj_org_article_cb3cac8df0c84e80b32ffb7150338bff
Other Identifiers
ISSN
2075-4701
E-ISSN
2075-4701
DOI
10.3390/met13020346
