A Lightweight Method for Detecting IC Wire Bonding Defects in X-ray Images
A Lightweight Method for Detecting IC Wire Bonding Defects in X-ray Images
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Author / Creator
Zhan, Daohua , Lin, Jian , Yang, Xiuding , Huang, Renbin , Yi, Kunran , Liu, Maoling , Zheng, Hehui , Xiong, Jingang , Cai, Nian , Wang, Han and Qiu, Baojun
Publisher
Switzerland: MDPI AG
Journal title
Language
English
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Publication information
Publisher
Switzerland: MDPI AG
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Scope and Contents
Contents
Integrated circuit (IC) X-ray wire bonding image inspections are crucial for ensuring the quality of packaged products. However, detecting defects in IC chips can be challenging due to the slow defect detection speed and the high energy consumption of the available models. In this paper, we propose a new convolutional neural network (CNN)-based fra...
Alternative Titles
Full title
A Lightweight Method for Detecting IC Wire Bonding Defects in X-ray Images
Authors, Artists and Contributors
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Record Identifier
TN_cdi_doaj_primary_oai_doaj_org_article_d4e3da056f274ce6bd9ef9f699a893d4
Permalink
https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_doaj_primary_oai_doaj_org_article_d4e3da056f274ce6bd9ef9f699a893d4
Other Identifiers
ISSN
2072-666X
E-ISSN
2072-666X
DOI
10.3390/mi14061119
