Understanding the Effect of Reflow Profile on the Metallurgical Properties of Tin–Bismuth Solders
Understanding the Effect of Reflow Profile on the Metallurgical Properties of Tin–Bismuth Solders
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Basel: MDPI AG
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Language
English
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Basel: MDPI AG
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Sn–Bi alloys are desirable candidates for soldering components on printed circuit boards (PCBs) because of their low melting point and reduced cost. While certain tin–bismuth solders are well characterized many new alloys in this family have been developed which need proper characterization. The following study looks at the behavior of four differe...
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Full title
Understanding the Effect of Reflow Profile on the Metallurgical Properties of Tin–Bismuth Solders
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TN_cdi_doaj_primary_oai_doaj_org_article_df3e82efe9c94800b19ecd44db1faa77
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https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_doaj_primary_oai_doaj_org_article_df3e82efe9c94800b19ecd44db1faa77
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ISSN
2075-4701
E-ISSN
2075-4701
DOI
10.3390/met12010121
