Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Int...
Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis
About this item
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Publisher
Cairo, Egypt: Hindawi Publishing Corporation
Journal title
Language
English
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Publisher
Cairo, Egypt: Hindawi Publishing Corporation
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Scope and Contents
Contents
An efficient simulation technique was proposed to examine the thermal-fluid structure interaction in the effects of solder temperature on pin through-hole during wave soldering. This study investigated the capillary flow behavior as well as the displacement, temperature distribution, and von Mises stress of a pin passed through a solder material. A...
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Full title
Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis
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TN_cdi_doaj_primary_oai_doaj_org_article_e35ca1036818457dbae412fa9e2c0f1e
Permalink
https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_doaj_primary_oai_doaj_org_article_e35ca1036818457dbae412fa9e2c0f1e
Other Identifiers
ISSN
2356-6140,1537-744X
E-ISSN
1537-744X
DOI
10.1155/2014/482363
