Fatigue life estimation of FBGA memory device under vibration
Fatigue life estimation of FBGA memory device under vibration
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Publisher
Dordrecht: Springer Netherlands
Journal title
Language
English
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Publisher
Dordrecht: Springer Netherlands
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Scope and Contents
Contents
This paper predicts the fatigue life of fine-pitch ball grid array (FBGA) solder joints in memory devices due to harmonic excitation through experiments and finite element analysis. Finite element models of the memory device with simplified solder joints and with detailed solder joints were developed as a global model and a local model, respectivel...
Alternative Titles
Full title
Fatigue life estimation of FBGA memory device under vibration
Authors, Artists and Contributors
Author / Creator
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Record Identifier
TN_cdi_nrf_kci_oai_kci_go_kr_ARTI_1058937
Permalink
https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_nrf_kci_oai_kci_go_kr_ARTI_1058937
Other Identifiers
ISSN
1738-494X
E-ISSN
1976-3824
DOI
10.1007/s12206-013-0946-5
