Cu-Al alloy formation by thermal annealing of Cu/Al multilayer films deposited by cyclic metal organ...
Cu-Al alloy formation by thermal annealing of Cu/Al multilayer films deposited by cyclic metal organic chemical vapor deposition
About this item
Full title
Author / Creator
Publisher
Springer: The Korean Institute of Metals and Materials
Journal title
Language
English
Formats
Publication information
Publisher
Springer: The Korean Institute of Metals and Materials
Subjects
More information
Scope and Contents
Contents
One of the most important issues in future Cu-based interconnects is to suppress the resistivity increase in the Cu interconnect line while decreasing the line width below 30 nm. For the purpose of mitigating the resistivity increase in the nanoscale Cu line, alloying Cu with traces of other elements is investigated. The formation of a Cu alloy lay...
Alternative Titles
Full title
Cu-Al alloy formation by thermal annealing of Cu/Al multilayer films deposited by cyclic metal organic chemical vapor deposition
Authors, Artists and Contributors
Author / Creator
Identifiers
Primary Identifiers
Record Identifier
TN_cdi_nrf_kci_oai_kci_go_kr_ARTI_705237
Permalink
https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_nrf_kci_oai_kci_go_kr_ARTI_705237
Other Identifiers
ISSN
1598-9623
E-ISSN
2005-4149
DOI
10.1007/s12540-013-3034-6
