Visualization of Kirkendall Voids at Cu-Au Interfaces by In Situ TEM Heating Studies
Visualization of Kirkendall Voids at Cu-Au Interfaces by In Situ TEM Heating Studies
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Publisher
New York: Springer US
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Language
English
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Publisher
New York: Springer US
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Contents
Gold-plated copper alloys are used extensively in electrical contacts where diffusional processes are known to cause contact degradation. An in situ transmission electron microscopy (TEM) heating study was carried out to provide fundamental understanding of the aging phenomena in reasonable timescales. Samples to visualize the interface in TEM were...
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Full title
Visualization of Kirkendall Voids at Cu-Au Interfaces by In Situ TEM Heating Studies
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Record Identifier
TN_cdi_osti_scitechconnect_1559505
Permalink
https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_osti_scitechconnect_1559505
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ISSN
1047-4838
E-ISSN
1543-1851
DOI
10.1007/s11837-019-03708-0
