Materials and noncoplanar mesh designs for integrated circuits with linear elastic responses to extr...
Materials and noncoplanar mesh designs for integrated circuits with linear elastic responses to extreme mechanical deformations
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Publisher
United States: National Academy of Sciences
Journal title
Language
English
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Publisher
United States: National Academy of Sciences
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Contents
Electronic systems that offer elastic mechanical responses to high-strain deformations are of growing interest because of their ability to enable new biomedical devices and other applications whose requirements are impossible to satisfy with conventional wafer-based technologies or even with those that offer simple bendability. This article introdu...
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Full title
Materials and noncoplanar mesh designs for integrated circuits with linear elastic responses to extreme mechanical deformations
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Record Identifier
TN_cdi_osti_scitechconnect_1875540
Permalink
https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_osti_scitechconnect_1875540
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ISSN
0027-8424
E-ISSN
1091-6490
DOI
10.1073/pnas.0807476105
