Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn–3.8Ag–0.7Cu solder...
Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn–3.8Ag–0.7Cu solders by adding Co nanoparticles
About this item
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Author / Creator
Yakymovych, A. , Plevachuk, Yu , Švec, P. , Janičkovič, D. , Šebo, P. , Beronská, N. , Nosko, M. , Orovcik, L. , Roshanghias, A. and Ipser, H.
Publisher
New York: Springer US
Journal title
Language
English
Formats
Publication information
Publisher
New York: Springer US
Subjects
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Scope and Contents
Contents
The effect of nanosized Co admixtures on the microstructure and physical properties of Sn–3.8Ag–0.7Cu solder and corresponding solder joints was investigated. The composite Sn–3.8Ag–0.7Cu ribbons with minor additions of Co nanoparticles (up to 1.0 wt%) were fabricated using the conventional planar flow casting method. The structure of nanostructure...
Alternative Titles
Full title
Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn–3.8Ag–0.7Cu solders by adding Co nanoparticles
Authors, Artists and Contributors
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Primary Identifiers
Record Identifier
TN_cdi_proquest_journals_1916630520
Permalink
https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_proquest_journals_1916630520
Other Identifiers
ISSN
0957-4522
E-ISSN
1573-482X
DOI
10.1007/s10854-017-6877-7
