Nanocopper Based Solder-Free Electronic Assembly
Nanocopper Based Solder-Free Electronic Assembly
About this item
Full title
Author / Creator
Schnabl, K. , Wentlent, L. , Mootoo, K. , Khasawneh, S. , Zinn, A. A. , Beddow, J. , Hauptfleisch, E. , Blass, D. and Borgesen, P.
Publisher
Boston: Springer US
Journal title
Language
English
Formats
Publication information
Publisher
Boston: Springer US
Subjects
More information
Scope and Contents
Contents
CuantumFuse nano copper material has been used to assemble functional LED test boards and a small camera board with a 48 pad CMOS sensor quad-flat no-lead chip and a 10 in flexible electronics demo. Drop-in replacement of solder, by use of stencil printing and standard surface mount technology equipment, has been demonstrated. Applications in space...
Alternative Titles
Full title
Nanocopper Based Solder-Free Electronic Assembly
Authors, Artists and Contributors
Identifiers
Primary Identifiers
Record Identifier
TN_cdi_proquest_journals_1926827392
Permalink
https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_proquest_journals_1926827392
Other Identifiers
ISSN
0361-5235
E-ISSN
1543-186X
DOI
10.1007/s11664-014-3478-6
