Recent progress on the development of Sn–Bi based low-temperature Pb-free solders
Recent progress on the development of Sn–Bi based low-temperature Pb-free solders
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Publisher
New York: Springer US
Journal title
Language
English
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Publication information
Publisher
New York: Springer US
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Scope and Contents
Contents
With the implementation of legislations on inhibiting the usage of Sn–Pb solder in consumer electronic products, Sn–Ag–Cu series solder has been gotten the most application. However, there are some stimulations from electronic manufacturers to adopt low temperature soldering such as the economic driver from the reduction in manufacturing assembly c...
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Full title
Recent progress on the development of Sn–Bi based low-temperature Pb-free solders
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Author / Creator
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TN_cdi_proquest_journals_2165968578
Permalink
https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_proquest_journals_2165968578
Other Identifiers
ISSN
0957-4522
E-ISSN
1573-482X
DOI
10.1007/s10854-019-00701-w
