Heterogeneous and Monolithic 3D Integration Technology for Mixed-Signal ICs
Heterogeneous and Monolithic 3D Integration Technology for Mixed-Signal ICs
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Basel: MDPI AG
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Language
English
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Basel: MDPI AG
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Contents
For next-generation system-on-chips (SoCs) in diverse applications (RF, sensor, display, etc.) which require high-performance, small form factors, and low power consumption, heterogeneous and monolithic 3D (M3D) integration employing advanced Si CMOS technology has been intriguing. To realize the M3D-based systems, it is important to take into acco...
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Full title
Heterogeneous and Monolithic 3D Integration Technology for Mixed-Signal ICs
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TN_cdi_proquest_journals_2724232053
Permalink
https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_proquest_journals_2724232053
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ISSN
2079-9292
E-ISSN
2079-9292
DOI
10.3390/electronics11193013
