Dual Coil Patterned Ultra‐Thin Silicon Film Enable by Double‐Sided Process (Adv. Mater. Interfaces 1...
Dual Coil Patterned Ultra‐Thin Silicon Film Enable by Double‐Sided Process (Adv. Mater. Interfaces 16/2023)
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Publisher
Weinheim: John Wiley & Sons, Inc
Journal title
Language
English
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Publisher
Weinheim: John Wiley & Sons, Inc
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Contents
Double‐Sided Microfabrication
Handling ultra‐thin silicon (UTS) has been challenging and current techniques are mostly limited to bonding UTS to another substrate. In article number 2300158, Chang Hee Son, Sangyeop Lee, Placid M. Ferreira, and Seok Kim introduce a unique technology for freely handling UTS which enables double‐sided processing. T...
Alternative Titles
Full title
Dual Coil Patterned Ultra‐Thin Silicon Film Enable by Double‐Sided Process (Adv. Mater. Interfaces 16/2023)
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TN_cdi_proquest_journals_2822633264
Permalink
https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_proquest_journals_2822633264
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ISSN
2196-7350
E-ISSN
2196-7350
DOI
10.1002/admi.202370053
