Effect of aerostatic spindle dynamic characteristics on the medium frequency waviness error of silic...
Effect of aerostatic spindle dynamic characteristics on the medium frequency waviness error of silicon wafer surface
About this item
Full title
Author / Creator
Li, Meng , Zhu, Xianglong , Kang, Renke , Li, Jiasheng and Xu, Jiahui
Publisher
London: Springer London
Journal title
Language
English
Formats
Publication information
Publisher
London: Springer London
Subjects
More information
Scope and Contents
Contents
In the process of ultra-precision grinding, the dynamic characteristics of the aerostatic spindle system are important factors affecting the machined surface morphology. In order to study the influence of the dynamic characteristics of the spindle system on the medium frequency waviness error of the silicon wafer surface, this paper first establish...
Alternative Titles
Full title
Effect of aerostatic spindle dynamic characteristics on the medium frequency waviness error of silicon wafer surface
Authors, Artists and Contributors
Author / Creator
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Record Identifier
TN_cdi_proquest_journals_2910024708
Permalink
https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_proquest_journals_2910024708
Other Identifiers
ISSN
0268-3768
E-ISSN
1433-3015
DOI
10.1007/s00170-023-12755-6
