Toward multi-programmed workloads with different memory footprints： a self-adaptive last level cache...
Toward multi-programmed workloads with different memory footprints： a self-adaptive last level cache scheduling scheme
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Beijing: Science China Press
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Language
English
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Beijing: Science China Press
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With the emerging of 3 D-stacking technology, the dynamic random-access memory（DRAM）can be stacked on chips to architect the DRAM last level cache（LLC）. Compared with static randomaccess memory（SRAM）, DRAM is larger but slower. In the existing research papers, a lot of work has been devoted to improving the workload performance using SRAM and stack...
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Toward multi-programmed workloads with different memory footprints： a self-adaptive last level cache scheduling scheme
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TN_cdi_proquest_journals_2918588494
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https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_proquest_journals_2918588494
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ISSN
1674-733X
E-ISSN
1869-1919
DOI
10.1007/s11432-016-0408-1
