Dynamic – Thermal Analyses of a Structurally Reconfigured Electronics Package Onboard Mini Satellite
Dynamic – Thermal Analyses of a Structurally Reconfigured Electronics Package Onboard Mini Satellite
Dynamic – Thermal Analyses of a Structurally Reconfigured Electronics Package Onboard Mini Satellite
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Publisher
Zurich: Trans Tech Publications Ltd
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Language
English
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Publisher
Zurich: Trans Tech Publications Ltd
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Scope and Contents
Contents
The electronics package in a spacecraft is subjected to a variety of dynamic loads during launch phase and suitable thermal environment for the mission life. The dynamic and thermal analyses performed for a structurally reconfigured electronics package. Two different simulation models are developed to carry out the analyses. This paper discusses in...
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Full title
Dynamic – Thermal Analyses of a Structurally Reconfigured Electronics Package Onboard Mini Satellite
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Author / Creator
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Record Identifier
TN_cdi_proquest_miscellaneous_1864553016
Permalink
https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_proquest_miscellaneous_1864553016
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ISBN
3038351636,9783038351634
ISSN
1660-9336,1662-7482
E-ISSN
1662-7482
DOI
