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Effect of Pd distribution on Pd-plated Cu wire using different electronic flame off settings

Effect of Pd distribution on Pd-plated Cu wire using different electronic flame off settings

https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_proquest_miscellaneous_1893892658

Effect of Pd distribution on Pd-plated Cu wire using different electronic flame off settings

About this item

Full title

Effect of Pd distribution on Pd-plated Cu wire using different electronic flame off settings

Publisher

New York: Springer US

Journal title

Journal of materials science. Materials in electronics, 2017-03, Vol.28 (6), p.4613-4618

Language

English

Formats

Publication information

Publisher

New York: Springer US

More information

Scope and Contents

Contents

Pd-coated Cu wires show interesting properties such as good electrical conductivity, thermal conductivity, and reliability and are widely used in microelectronic packaging. However, during the formation of free air balls (FABs) and bonded balls via Pd-coated Cu wires, the electronic flame off (EFO) current setting affects Pd distribution in FABs an...

Alternative Titles

Full title

Effect of Pd distribution on Pd-plated Cu wire using different electronic flame off settings

Authors, Artists and Contributors

Identifiers

Primary Identifiers

Record Identifier

TN_cdi_proquest_miscellaneous_1893892658

Permalink

https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_proquest_miscellaneous_1893892658

Other Identifiers

ISSN

0957-4522

E-ISSN

1573-482X

DOI

10.1007/s10854-016-6099-4

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