Optimization of the Boundary Conditions of a Board Level Reliability Test Board to Maximize the Fati...
Optimization of the Boundary Conditions of a Board Level Reliability Test Board to Maximize the Fatigue Life of Ball Grid Array Solder Joints under Thermal Cycling and Random Vibration
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Publisher
Switzerland: MDPI AG
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Language
English
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Publisher
Switzerland: MDPI AG
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Scope and Contents
Contents
We investigated the screw hole position of a board level reliability (BLR) test board to improve the fatigue reliability of solder joints under thermal cycling and random vibration. We developed a finite element model of a BLR test board and derived the plastic strain energy density and 1-sigma stress, which are the main parameters influencing the...
Alternative Titles
Full title
Optimization of the Boundary Conditions of a Board Level Reliability Test Board to Maximize the Fatigue Life of Ball Grid Array Solder Joints under Thermal Cycling and Random Vibration
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Author / Creator
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TN_cdi_proquest_miscellaneous_3035075036
Permalink
https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_proquest_miscellaneous_3035075036
Other Identifiers
ISSN
1996-1944
E-ISSN
1996-1944
DOI
10.3390/ma17030755
