INTERNATIONAL PATENT: INTEL NDTM US LLC, LIU, LIU, SUN, CHUAN, ZHAO, JIANZE FILES APPLICATION FOR "C...
INTERNATIONAL PATENT: INTEL NDTM US LLC, LIU, LIU, SUN, CHUAN, ZHAO, JIANZE FILES APPLICATION FOR "CONSOLIDATION OF STAIRCASE AREA ETCH AND CMOS CONTACT AREA ETCH IN 3D NAND"
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Full title
INTERNATIONAL PATENT: INTEL NDTM US LLC, LIU, LIU, SUN, CHUAN, ZHAO, JIANZE FILES APPLICATION FOR "CONSOLIDATION OF STAIRCASE AREA ETCH AND CMOS CONTACT AREA ETCH IN 3D NAND"
Publisher
Washington, D.C: HT Digital Streams Limited
Journal title
US Fed News Service, Including US State News, 2023
Language
English
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Publication information
Publisher
Washington, D.C: HT Digital Streams Limited
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Full title
INTERNATIONAL PATENT: INTEL NDTM US LLC, LIU, LIU, SUN, CHUAN, ZHAO, JIANZE FILES APPLICATION FOR "CONSOLIDATION OF STAIRCASE AREA ETCH AND CMOS CONTACT AREA ETCH IN 3D NAND"
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Record Identifier
TN_cdi_proquest_wirefeeds_2885939043
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https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_proquest_wirefeeds_2885939043
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