LSI Logic Licenses EPBGA Package Technology to Global Packaging Leader Amkor Technology
LSI Logic Licenses EPBGA Package Technology to Global Packaging Leader Amkor Technology
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New York: PR Newswire Association LLC
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New York: PR Newswire Association LLC
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MILPITAS, Calif. and WEST CHESTER, Pa., April 28 /PRNewswire/ -- System-on-a-chip leader LSI Logic Corporation (NYSE: LSI) and worldwide packaging leader Amkor Technology Inc. (Nasdaq: AMKR) today announced a licensing agreement that provides Amkor access to LSI Logic's Enhanced Plastic Ball Grid Array (EPBGA) technology, a key component in high vo...
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LSI Logic Licenses EPBGA Package Technology to Global Packaging Leader Amkor Technology
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TN_cdi_proquest_wirefeeds_449754927
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https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_proquest_wirefeeds_449754927