LSI Logic Licenses EPBGA Package Technology to Global Packaging Leader Amkor Technology
LSI Logic Licenses EPBGA Package Technology to Global Packaging Leader Amkor Technology
About this item
Full title
LSI Logic Licenses EPBGA Package Technology to Global Packaging Leader Amkor Technology
Publisher
New York: PR Newswire Association LLC
Journal title
PR Newswire, 1999, p.1
Language
English
Formats
Publication information
Publisher
New York: PR Newswire Association LLC
Subjects
More information
Scope and Contents
Contents
MILPITAS, Calif. and WEST CHESTER, Pa., April 28 /PRNewswire/ -- System-on-a-chip leader LSI Logic Corporation (NYSE: LSI) and worldwide packaging leader Amkor Technology Inc. (Nasdaq: AMKR) today announced a licensing agreement that provides Amkor access to LSI Logic's Enhanced Plastic Ball Grid Array (EPBGA) technology, a key component in high vo...
Alternative Titles
Full title
LSI Logic Licenses EPBGA Package Technology to Global Packaging Leader Amkor Technology
Identifiers
Primary Identifiers
Record Identifier
TN_cdi_proquest_wirefeeds_449754927
Permalink
https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_proquest_wirefeeds_449754927
How to access this item
Log in as a Library member
