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LSI Logic Licenses EPBGA Package Technology to Global Packaging Leader Amkor Technology

LSI Logic Licenses EPBGA Package Technology to Global Packaging Leader Amkor Technology

https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_proquest_wirefeeds_449754927

LSI Logic Licenses EPBGA Package Technology to Global Packaging Leader Amkor Technology

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Full title

LSI Logic Licenses EPBGA Package Technology to Global Packaging Leader Amkor Technology

Publisher

New York: PR Newswire Association LLC

Journal title

PR Newswire, 1999, p.1

Language

English

Publication information

Publisher

New York: PR Newswire Association LLC

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Scope and Contents

Contents

MILPITAS, Calif. and WEST CHESTER, Pa., April 28 /PRNewswire/ -- System-on-a-chip leader LSI Logic Corporation (NYSE: LSI) and worldwide packaging leader Amkor Technology Inc. (Nasdaq: AMKR) today announced a licensing agreement that provides Amkor access to LSI Logic's Enhanced Plastic Ball Grid Array (EPBGA) technology, a key component in high vo...

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Full title

LSI Logic Licenses EPBGA Package Technology to Global Packaging Leader Amkor Technology

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Record Identifier

TN_cdi_proquest_wirefeeds_449754927

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https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_proquest_wirefeeds_449754927

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