Silica-Fiber-Reinforced Composites for Microelectronic Applications: Effects of Curing Routes
Silica-Fiber-Reinforced Composites for Microelectronic Applications: Effects of Curing Routes
About this item
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Publisher
Switzerland: MDPI AG
Journal title
Language
English
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Publisher
Switzerland: MDPI AG
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Scope and Contents
Contents
For curing of fiber-reinforced epoxy composites, an alternative to thermal heating is the use of microwave energy, which cures quickly and consumes less energy. Employing thermal curing (TC) and microwave (MC) curing methods, we present a comparative study on the functional characteristics of fiber-reinforced composite for microelectronics. The com...
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Full title
Silica-Fiber-Reinforced Composites for Microelectronic Applications: Effects of Curing Routes
Authors, Artists and Contributors
Author / Creator
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Primary Identifiers
Record Identifier
TN_cdi_pubmedcentral_primary_oai_pubmedcentral_nih_gov_10003988
Permalink
https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_pubmedcentral_primary_oai_pubmedcentral_nih_gov_10003988
Other Identifiers
ISSN
1996-1944
E-ISSN
1996-1944
DOI
10.3390/ma16051790
