Heat transfer in electronic equipment : presented at the winter annual meeting of the American Socie...
Heat transfer in electronic equipment : presented at the winter annual meeting of the American Society of Mechanical Engineers, Washington, D.C., November 15-20, 1981 / sponsored by the K-12 Committee on Aircraft and Astronautical Heat Transfer, the Heat Transfer Division, ASME ; edited by Matthew D. Kelleher, M. Michael Yovanovich.
About this item
Full title
Publisher
New York, N.Y. (345 E. 47th St., New York 10017) : ASME, c1981.
Call Numbers
NQ621.3815/11
Record Identifier
MMS ID
Language
English
Formats
Physical Description
Physical content
v, 64 p. : ill. ; 28 cm.
Contents
Thermal considerations in the packaging of electrical and electronic components / A. Bar-Cohen and A. Kraus -- Thermally optimum spacing of vertical, natural convection cooled, parallel plates / A. Bar-Cohen and W.M. Rohsenow -- Experimental investigations on the temperature rise of printed circuit...
Publication information
Publisher
New York, N.Y. (345 E. 47th St., New York 10017) : ASME, c1981.
Place of Publication
New York (State)
Date Published
c1981.
Subjects
More information
Alternative Titles
Full title
Heat transfer in electronic equipment : presented at the winter annual meeting of the American Society of Mechanical Engineers, Washington, D.C., November 15-20, 1981 / sponsored by the K-12 Committee on Aircraft and Astronautical Heat Transfer, the Heat Transfer Division, ASME ; edited by Matthew D. Kelleher, M. Michael Yovanovich.
Authors, Artists and Contributors
Notes
General note
"HTD-vol. 20."
Includes bibliographical references.
Contextual Information
Date Copyright
c1981.
Identifiers
Primary Identifiers
Call Numbers
NQ621.3815/11
Record Identifier
74Vv3LGg8PoX
Permalink
https://devfeature-collection.sl.nsw.gov.au/record/74Vv3LGg8PoX
Other Identifiers
DDC
621.3815
MMS ID
991009743129702626