Structure Performance Correlation of N-Heterocyclic Oligomer Leveler for Acid Copper Plating of Adva...
Structure Performance Correlation of N-Heterocyclic Oligomer Leveler for Acid Copper Plating of Advanced Interconnects
About this item
Full title
Author / Creator
Peng, Chuan , Zhai, Yuehui , Chen, Xianming , Wang, Chong , Hong, Yan , Chen, Yuanming , He, Wei , Zhou, Guoyun and Liu, Binyun
Publisher
Switzerland: MDPI AG
Journal title
Language
English
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Publication information
Publisher
Switzerland: MDPI AG
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More information
Scope and Contents
Contents
Levelers, as an essential part of organic additives in copper electroplating, play a crucial role in the fabrication of sophisticated interconnects in integrated circuits, packaging substrates, and printed circuit boards. In this work, four N-heterocyclic oligomers were synthesized and characterized, along with investigations of their electrochemic...
Alternative Titles
Full title
Structure Performance Correlation of N-Heterocyclic Oligomer Leveler for Acid Copper Plating of Advanced Interconnects
Authors, Artists and Contributors
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Record Identifier
TN_cdi_doaj_primary_oai_doaj_org_article_124ea441f46c45aba1ca5af1cc1bee0c
Permalink
https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_doaj_primary_oai_doaj_org_article_124ea441f46c45aba1ca5af1cc1bee0c
Other Identifiers
ISSN
1420-3049
E-ISSN
1420-3049
DOI
10.3390/molecules28062783
