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30 results for Zhou,+Guoyun

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ArticlesPeer ReviewedFull Text
Morphology-Dependent Behavior of PVDF/ZnO Composites: Their Fabrication and Application in Pressure Sensors
Author / Creator:Zhang, Binbin ; Zhang, Wenhui ; Luo, Wei ; Liang, Zhijie ; Hong, Yan ; Li, Jianhui ; Zhou, Guoyun ; He, Wei
Publisher:Switzerland: MDPI AG
Journal title:Sensors (Basel, Switzerland), 2025-05, Vol.25 (9), p.2936
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Structure Performance Correlation of N-Heterocyclic Oligomer Leveler for Acid Copper Plating of Advanced Interconnects
Author / Creator:Peng, Chuan ; Zhai, Yuehui ; Chen, Xianming ; Wang, Chong ; Hong, Yan ; Chen, Yuanming ; He, Wei ; Zhou, Guoyun ; Liu, Binyun
Publisher:Switzerland: MDPI AG
Journal title:Molecules (Basel, Switzerland), 2023-03, Vol.28 (6), p.2783
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ArticlesPeer ReviewedFull Text
Chemically integrated nickel-based resistors on printed circuits and its resistance precisely controlled
Author / Creator:Zhou, Guoyun ; Zhang, Xiumei ; Hong, Yan ; Wang, Yuefeng ; Wang, Chong ; He, Wei ; Wang, Shouxu ; Chen, Yuanming ; Chen, Shijin ; Han, Zhiwei ; Xu, Huan
Publisher:New York: Springer US
Journal title:Journal of materials science. Materials in electronics, 2021-07, Vol.32 (13), p.17143-17153
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Investigation on Cu–Sn intermetallic compounds growth and signal transmission loss of the diverse copper lines after soldering in printed circuit board
Author / Creator:Chen, Yuanming ; Zhang, Lingzhi ; Xu, Jiaying ; Fang, Jianrong ; You, Xiangqing ; Tan, Zhengdong ; Wang, Haiying ; Zhou, Guoyun ; Wang, Shouxu ; He, Wei ; Luo, Yuyao ; Ye, Yiling
Publisher:New York: Springer US
Journal title:Journal of materials science. Materials in electronics, 2021-09, Vol.32 (17), p.22372-22386
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ArticlesPeer ReviewedFull Text
Mechanism of a catalytic silver(I)-complex: assisted electroless deposition of inductance coil on poly(ethylene terephthalate) film
Author / Creator:Wang, Yuefeng ; Hong, Yan ; Zhou, Guoyun ; Wang, Xinhai ; Song, Jianheng ; He, Wei ; Gao, Zhengping ; Zhang, Weihua ; Sun, Rui ; Sun, Yukai ; Ai, Kehua ; Li, Qinghua
Publisher:New York: Springer US
Journal title:Journal of materials science. Materials in electronics, 2020-06, Vol.31 (11), p.8165-8173
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Mechanism of TangGanJian on nonalcoholic fatty liver disease with type 2 diabetes mellitus
Author / Creator:Fan, Yanbo ; Xiong, Wei ; Li, Jingjing ; Hu, Aimin ; He, Zhiwei ; Zhang, Jiawen ; Zhou, Guoyun ; Yin, Qiang
Publisher:England: Taylor & Francis
Journal title:Pharmaceutical biology, 2018-01, Vol.56 (1), p.567-572
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Preparation and properties of a novel electrically conductive adhesive using a composite of silver nanorods, silver nanoparticles, and modified epoxy resin
Author / Creator:Yang, Xiaojian ; He, Wei ; Wang, Shouxu ; Zhou, Guoyun ; Tang, Yao
Publisher:Boston: Springer US
Journal title:Journal of materials science. Materials in electronics, 2012-01, Vol.23 (1), p.108-114
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ArticlesPeer ReviewedFull Text
GIS-Based Probabilistic Mapping of Landslide Hazard Using a Three-Dimensional Deterministic Model
Author / Creator:Xie, Mowen ; Esaki, Tetsuro ; Zhou, Guoyun
Publisher:Dordrecht: Springer
Journal title:Natural hazards (Dordrecht), 2004-10, Vol.33 (2), p.265-282
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Effect of the different shapes of silver particles in conductive ink on electrical performance and microstructure of the conductive tracks
Author / Creator:Yang, Xiaojian ; He, Wei ; Wang, Shouxu ; Zhou, Guoyun ; Tang, Yao ; Yang, Juanhong
Publisher:Boston: Springer US
Journal title:Journal of materials science. Materials in electronics, 2012-11, Vol.23 (11), p.1980-1986
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ArticlesPeer ReviewedFull Text
Preparation of High-Performance Conductive Ink with Silver Nanoparticles and Nanoplates for Fabricating Conductive Films
Author / Creator:Yang, Xiaojian ; He, Wei ; Wang, Shouxu ; Zhou, Guoyun ; Tang, Yao
Publisher:Colchester: Taylor & Francis Group
Journal title:Materials and manufacturing processes, 2012-12, Vol.28 (1), p.1-4
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ArticlesPeer ReviewedFull Text
GIS-based spatial and temporal prediction system development for regional land subsidence hazard mitigation
Author / Creator:Zhou, Guoyun ; Esaki, Tetsuro ; Mori, Jiro
Publisher:Berlin: Springer Nature B.V
Journal title:Environmental earth sciences, 2003-09, Vol.44 (6), p.665
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ArticlesFull Text
Topology Optimization with Aperiodic Load Fatigue Constraints Based on Bidirectional Evolutionary Structural Optimization
Author / Creator:Li, Yongxin ; Zhou, Guoyun ; Chang, Tao ; Yang, Liming ; Wu, Fenghe
Publisher:Henderson: Tech Science Press
Journal title:Computer modeling in engineering & sciences, 2022, Vol.130 (1), p.499-511
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ArticlesPeer ReviewedFull Text
Surface-enhanced Raman imaging through sprayed probes for the application in chemical visualization of methamphetamine within fingerprints
Author / Creator:Zhang, Yating ; Xu, Buyi ; Wang, Zehua ; Yang, Rongji ; Zhu, Leixia ; He, Wei ; Zhou, Guoyun ; Li, Jiujuan ; Li, Jianhui ; Han, Zhiwei ; Hong, Yan ; Wang, Shouxu
Publisher:Berlin/Heidelberg: Springer Berlin Heidelberg
Journal title:Analytical and bioanalytical chemistry, 2023-08, Vol.415 (19), p.4713-4723
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ArticlesPeer ReviewedFull Text
Fabrication and characterization of nano-ZnO/CNTs/PDMS flexible pressure sensor
Author / Creator:Chen, Yuanming ; Li, Jiaqi ; Hong, Yan ; He, Wei ; Tang, Yao ; Zhou, Guoyun ; Xu, Zhenlin ; He, Yaozong ; Nie, Zhiguo ; Zhang, Jiaqiang ; Wang, Shouxu
Publisher:New York: Springer US
Journal title:Journal of materials science. Materials in electronics, 2023-07, Vol.34 (21), p.1600, Article 1600
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ArticlesPeer ReviewedFull Text
Study on copper interconnection structure of flexible electronics by Ag-PT composite membrane induced electrodeposition
Author / Creator:Li, Jiujuan ; Zhao, Hongwei ; Zhou, Guoyun ; Wu, Hong ; He, Wei ; Chen, Yuanming ; Tang, Yao ; Zhang, Huaiwu ; Huang, Yunzhong ; Sun, Yukai ; Zhu, Yongkang
Publisher:New York: Springer US
Journal title:Journal of materials science. Materials in electronics, 2023-02, Vol.34 (6), p.483, Article 483
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ArticlesPeer ReviewedFull Text
Effect of surface finishing on signal transmission loss of microstrip copper lines for high-speed PCB
Author / Creator:Chen, Yuanming ; Gao, Yali ; Jin, Xiaofeng ; Zhou, Xuan ; Wang, Shouxu ; He, Wei ; Hong, Yan ; Zhou, Guoyun ; Zhang, Weihua ; Sun, Rui ; Huang, Yunzhong ; Tang, Yao
Publisher:New York: Springer US
Journal title:Journal of materials science. Materials in electronics, 2019-09, Vol.30 (17), p.16226-16233
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ArticlesPeer ReviewedFull Text
Fabrication of silver electrically conductive adhesive to apply in through-hole filling for PCB interconnection
Author / Creator:Zhou, Guoyun ; Mao, Yingjie ; Wang, Chong ; Wang, Shouxu ; Chen, Yuanming ; He, Wei
Publisher:New York: Springer US
Journal title:Journal of materials science. Materials in electronics, 2016-09, Vol.27 (9), p.9186-9190
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ArticlesPeer ReviewedFull Text
A composite of epoxy resin/copper(II) acetylacetonae as catalyst of copper addition on insulated substrate
Author / Creator:Li, Jiujuan ; Zhou, Guoyun ; Hong, Yan ; He, Wei ; Wang, Shouxu ; Yang, Wenjun ; Su, Xinhong ; Hu, Yongsuan ; Xia, Feng ; Jin, Xiaofeng
Publisher:New York: Springer US
Journal title:Journal of materials science. Materials in electronics, 2018-06, Vol.29 (11), p.9460-9465
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ArticlesPeer ReviewedFull Text
GIS COMPONENT BASED 3D LANDSLIDE HAZARD ASSESSMENT SYSTEM：3DSLOPEGIS
Author / Creator:Xie, Mo-wen ; Zhou, Guo-yun ; Esaki, Tetsuro
Publisher:Dordrecht: Springer Nature B.V
Journal title:Chinese geographical science, 2003-03, Vol.13 (1), p.66-72
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ArticlesPeer ReviewedFull Text
Effects of microstrip line fabrication and design on high-speed signal integrity transmission of PCB manufacturing process
Author / Creator:Wang, Shouxu ; Xu, Xiaolan ; Zhou, Guoyun ; Chen, Yuanming ; He, Wei ; Yang, Wenjun ; Su, Xinhong ; Hu, Yongshuan
Publisher:Bradford: Emerald Publishing Limited
Journal title:Circuit world, 2018-04, Vol.44 (2), p.53-59
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Showing 1 to 20 of 30 results

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Morphology-Dependent Behavior of PVDF/ZnO Composites: Their Fabrication and Application in Pressure Sensors

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Structure Performance Correlation of N-Heterocyclic Oligomer Leveler for Acid Copper Plating of Advanced Interconnects

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Chemically integrated nickel-based resistors on printed circuits and its resistance precisely controlled

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Investigation on Cu–Sn intermetallic compounds growth and signal transmission loss of the diverse copper lines after soldering in printed circuit board

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Mechanism of a catalytic silver(I)-complex: assisted electroless deposition of inductance coil on poly(ethylene terephthalate) film

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Mechanism of TangGanJian on nonalcoholic fatty liver disease with type 2 diabetes mellitus

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Preparation and properties of a novel electrically conductive adhesive using a composite of silver nanorods, silver nanoparticles, and modified epoxy resin

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GIS-Based Probabilistic Mapping of Landslide Hazard Using a Three-Dimensional Deterministic Model

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Effect of the different shapes of silver particles in conductive ink on electrical performance and microstructure of the conductive tracks

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Preparation of High-Performance Conductive Ink with Silver Nanoparticles and Nanoplates for Fabricating Conductive Films

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GIS-based spatial and temporal prediction system development for regional land subsidence hazard mitigation

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Topology Optimization with Aperiodic Load Fatigue Constraints Based on Bidirectional Evolutionary Structural Optimization

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Surface-enhanced Raman imaging through sprayed probes for the application in chemical visualization of methamphetamine within fingerprints

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Fabrication and characterization of nano-ZnO/CNTs/PDMS flexible pressure sensor

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Study on copper interconnection structure of flexible electronics by Ag-PT composite membrane induced electrodeposition

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Effect of surface finishing on signal transmission loss of microstrip copper lines for high-speed PCB

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Fabrication of silver electrically conductive adhesive to apply in through-hole filling for PCB interconnection

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A composite of epoxy resin/copper(II) acetylacetonae as catalyst of copper addition on insulated substrate

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GIS COMPONENT BASED 3D LANDSLIDE HAZARD ASSESSMENT SYSTEM：3DSLOPEGIS

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Effects of microstrip line fabrication and design on high-speed signal integrity transmission of PCB manufacturing process

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