A universal packaging substrate for mechanically stable assembly of stretchable electronics
A universal packaging substrate for mechanically stable assembly of stretchable electronics
About this item
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Author / Creator
Shao, Yan , Yan, Jianfeng , Zhi, Yinglin , Li, Chun , Li, Qingxian , Wang, Kaimin , Xia, Rui , Xiang, Xinyue , Liu, Liqian , Chen, Guoli , Zhang, Hanxue , Cai, Daohang , Wang, Haochuan , Cheng, Xing , Yang, Canhui , Ren, Fuzeng and Yu, Yanhao
Publisher
London: Nature Publishing Group UK
Journal title
Language
English
Formats
Publication information
Publisher
London: Nature Publishing Group UK
Subjects
More information
Scope and Contents
Contents
Stretchable electronics commonly assemble multiple material modules with varied bulk moduli and surface chemistry on one packaging substrate. Preventing the strain-induced delamination between the module and the substrate has been a critical challenge. Here we develop a packaging substrate that delivers mechanically stable module/substrate interfac...
Alternative Titles
Full title
A universal packaging substrate for mechanically stable assembly of stretchable electronics
Authors, Artists and Contributors
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Primary Identifiers
Record Identifier
TN_cdi_doaj_primary_oai_doaj_org_article_166688f158524bed9b3d55f6b7eae904
Permalink
https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_doaj_primary_oai_doaj_org_article_166688f158524bed9b3d55f6b7eae904
Other Identifiers
ISSN
2041-1723
E-ISSN
2041-1723
DOI
10.1038/s41467-024-50494-8
