Experimental Strategies for Studying Tribo-Electrochemical Aspects of Chemical–Mechanical Planarizat...
Experimental Strategies for Studying Tribo-Electrochemical Aspects of Chemical–Mechanical Planarization
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Basel: MDPI AG
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Language
English
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Basel: MDPI AG
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Chemical–mechanical planarization (CMP) is used to smoothen the topographies of a rough surface by combining several functions of tribology (friction, lubrication), chemistry, and electrochemistry (corrosion, wear, tribo-corrosion). The surface layer of interest is structurally weakened by the chemical and/or electrochemical reactions of selected a...
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Experimental Strategies for Studying Tribo-Electrochemical Aspects of Chemical–Mechanical Planarization
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TN_cdi_doaj_primary_oai_doaj_org_article_49c411d6eec341a284d09a6c2d6680c2
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https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_doaj_primary_oai_doaj_org_article_49c411d6eec341a284d09a6c2d6680c2
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ISSN
2075-4442
E-ISSN
2075-4442
DOI
10.3390/lubricants12020063
