Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding
Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding
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Switzerland: MDPI AG
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Language
English
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Switzerland: MDPI AG
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Device encapsulation and packaging often constitutes a substantial part of the fabrication cost of micro electro-mechanical systems (MEMS) transducers and imaging sensor devices. In this paper, we propose a simple and cost-effective wafer-level capping method that utilizes a limited number of highly standardized process steps as well as low-cost ma...
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Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding
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TN_cdi_doaj_primary_oai_doaj_org_article_7c1cdf4d913b45a2a6cdd64ad6639870
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https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_doaj_primary_oai_doaj_org_article_7c1cdf4d913b45a2a6cdd64ad6639870
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ISSN
2072-666X
E-ISSN
2072-666X
DOI
10.3390/mi7100192
