Large-area integration of two-dimensional materials and their heterostructures by wafer bonding
Large-area integration of two-dimensional materials and their heterostructures by wafer bonding
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Publisher
London: Nature Publishing Group UK
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Language
English
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London: Nature Publishing Group UK
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Contents
Integrating two-dimensional (2D) materials into semiconductor manufacturing lines is essential to exploit their material properties in a wide range of application areas. However, current approaches are not compatible with high-volume manufacturing on wafer level. Here, we report a generic methodology for large-area integration of 2D materials by ad...
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Full title
Large-area integration of two-dimensional materials and their heterostructures by wafer bonding
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TN_cdi_doaj_primary_oai_doaj_org_article_8af99583e0ae4934b663750930c1b923
Permalink
https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_doaj_primary_oai_doaj_org_article_8af99583e0ae4934b663750930c1b923
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ISSN
2041-1723
E-ISSN
2041-1723
DOI
10.1038/s41467-021-21136-0
