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A comparative study of interfacial thermal conductance between metal and semiconductor

A comparative study of interfacial thermal conductance between metal and semiconductor

https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_doaj_primary_oai_doaj_org_article_9546769c70a449dcb4559efc0478b4a6

A comparative study of interfacial thermal conductance between metal and semiconductor

About this item

Full title

A comparative study of interfacial thermal conductance between metal and semiconductor

Publisher

London: Nature Publishing Group UK

Journal title

Scientific reports, 2022-11, Vol.12 (1), p.19907-19907, Article 19907

Language

English

Formats

Publication information

Publisher

London: Nature Publishing Group UK

More information

Scope and Contents

Contents

To understand and control thermal conductance of interface between metal and semiconductor has now become a crucial task for the thermal design and management of nano-electronic and micro-electronic devices. The interfacial alignments and electronic characteristics of the interfaces between metal and semiconductor are studied using a first-principl...

Alternative Titles

Full title

A comparative study of interfacial thermal conductance between metal and semiconductor

Identifiers

Primary Identifiers

Record Identifier

TN_cdi_doaj_primary_oai_doaj_org_article_9546769c70a449dcb4559efc0478b4a6

Permalink

https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_doaj_primary_oai_doaj_org_article_9546769c70a449dcb4559efc0478b4a6

Other Identifiers

ISSN

2045-2322

E-ISSN

2045-2322

DOI

10.1038/s41598-022-24379-z

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