Vertical integration of microchips by magnetic assembly and edge wire bonding
Vertical integration of microchips by magnetic assembly and edge wire bonding
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Publisher
London: Nature Publishing Group UK
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Language
English
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London: Nature Publishing Group UK
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The out-of-plane integration of microfabricated planar microchips into functional three-dimensional (3D) devices is a challenge in various emerging MEMS applications such as advanced biosensors and flow sensors. However, no conventional approach currently provides a versatile solution to vertically assemble sensitive or fragile microchips into a se...
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Vertical integration of microchips by magnetic assembly and edge wire bonding
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TN_cdi_doaj_primary_oai_doaj_org_article_95ede9cb1ab342acb1a4717d93a81d7e
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https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_doaj_primary_oai_doaj_org_article_95ede9cb1ab342acb1a4717d93a81d7e
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ISSN
2055-7434,2096-1030
E-ISSN
2055-7434
DOI
10.1038/s41378-019-0126-6
