Epidermal Electronics
Epidermal Electronics
About this item
Full title
Author / Creator
Univ. of Illinois at Urbana-Champaign, IL (United States) , Kim, Dae-Hyeong , Lu, Nanshu , Ma, Rui , Kim, Yun-Soung , Kim, Rak-Hwan , Wang, Shuodao , Wu, Jian , Won, Sang Min , Tao, Hu , Islam, Ahmad , Yu, Ki Jun , Kim, Tae-il , Chowdhury, Raeed , Ying, Ming , Xu, Lizhi , Li, Ming , Chung, Hyun-Joong , Keum, Hohyun , McCormick, Martin , Liu, Ping , Zhang, Yong-Wei , Omenetto, Fiorenzo G. , Huang, Yonggang , Coleman, Todd and Rogers, John A.
Publisher
Washington, DC: American Association for the Advancement of Science
Journal title
Language
English
Formats
Publication information
Publisher
Washington, DC: American Association for the Advancement of Science
Subjects
More information
Scope and Contents
Contents
We report classes of electronic systems that achieve thicknesses, effective elastic moduli, bending stiffnesses, and areal mass densities matched to the epidermis. Unlike traditional wafer-based technologies, laminating such devices onto the skin leads to conformal contact and adequate adhesion based on van der Waals interactions alone, in a manner...
Alternative Titles
Full title
Epidermal Electronics
Authors, Artists and Contributors
Author / Creator
Kim, Dae-Hyeong
Lu, Nanshu
Ma, Rui
Kim, Yun-Soung
Kim, Rak-Hwan
Wang, Shuodao
Wu, Jian
Won, Sang Min
Tao, Hu
Islam, Ahmad
Yu, Ki Jun
Kim, Tae-il
Chowdhury, Raeed
Ying, Ming
Xu, Lizhi
Li, Ming
Chung, Hyun-Joong
Keum, Hohyun
McCormick, Martin
Liu, Ping
Zhang, Yong-Wei
Omenetto, Fiorenzo G.
Huang, Yonggang
Coleman, Todd
Rogers, John A.
Identifiers
Primary Identifiers
Record Identifier
TN_cdi_osti_scitechconnect_1875151
Permalink
https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_osti_scitechconnect_1875151
Other Identifiers
ISSN
0036-8075
E-ISSN
1095-9203
DOI
10.1126/science.1206157