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Epidermal Electronics

Epidermal Electronics

https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_osti_scitechconnect_1875151

Epidermal Electronics

About this item

Full title

Epidermal Electronics

Publisher

Washington, DC: American Association for the Advancement of Science

Journal title

Science (American Association for the Advancement of Science), 2011-08, Vol.333 (6044), p.838-843

Language

English

Formats

Publication information

Publisher

Washington, DC: American Association for the Advancement of Science

More information

Scope and Contents

Contents

We report classes of electronic systems that achieve thicknesses, effective elastic moduli, bending stiffnesses, and areal mass densities matched to the epidermis. Unlike traditional wafer-based technologies, laminating such devices onto the skin leads to conformal contact and adequate adhesion based on van der Waals interactions alone, in a manner...

Alternative Titles

Full title

Epidermal Electronics

Identifiers

Primary Identifiers

Record Identifier

TN_cdi_osti_scitechconnect_1875151

Permalink

https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_osti_scitechconnect_1875151

Other Identifiers

ISSN

0036-8075

E-ISSN

1095-9203

DOI

10.1126/science.1206157