Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?
Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?
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Publisher
Boston: Springer US
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Language
English
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Publisher
Boston: Springer US
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Scope and Contents
Contents
Silver (Ag) has been under development for use as interconnect material for power electronics packaging since the late 1980s. Despite its long development history, high thermal and electrical conductivities, and lead-free composition, sintered Ag technology has limited market penetration. This review sets out to explore what is required to make thi...
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Full title
Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?
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TN_cdi_proquest_journals_1512182320
Permalink
https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_proquest_journals_1512182320
Other Identifiers
ISSN
0361-5235
E-ISSN
1543-186X
DOI
10.1007/s11664-013-2967-3
