Mechanical Reliability of the Epoxy Sn-58wt.%Bi Solder Joints with Different Surface Finishes Under...
Mechanical Reliability of the Epoxy Sn-58wt.%Bi Solder Joints with Different Surface Finishes Under Thermal Shock
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Publisher
New York: Springer US
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Language
English
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Publisher
New York: Springer US
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Contents
The effect of thermal shock on the mechanical reliability of epoxy Sn-58wt.%Bi composite (epoxy Sn-58wt.%Bi) solder joints was investigated with different surface-finished substrates. Sn-58wt.%Bi-based solder has been considered as a promising candidate for low-temperature solder among various lead-free solders. However, Sn-58wt.%Bi solder joints c...
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Full title
Mechanical Reliability of the Epoxy Sn-58wt.%Bi Solder Joints with Different Surface Finishes Under Thermal Shock
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TN_cdi_proquest_journals_2022456837
Permalink
https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_proquest_journals_2022456837
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ISSN
0361-5235
E-ISSN
1543-186X
DOI
10.1007/s11664-018-6224-7
