Effect of SDBS on the oxidation reliability of screen-printed Cu circuits
Effect of SDBS on the oxidation reliability of screen-printed Cu circuits
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Publisher
New York: Springer US
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Language
English
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Publisher
New York: Springer US
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Scope and Contents
Contents
Cu nanopaste is a candidate to replace Ag nanopaste, but the oxidation problems associated with Cu nanopaste must be overcome. In this study, we fabricated Cu nanopaste with various contents of sodium dodecylbenzene sulfonate (SDBS), and the oxidation behaviors of Cu nanopaste with various contents of SDBS were investigated. Then, Cu nanopastes wer...
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Full title
Effect of SDBS on the oxidation reliability of screen-printed Cu circuits
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TN_cdi_proquest_journals_2352077693
Permalink
https://devfeature-collection.sl.nsw.gov.au/record/TN_cdi_proquest_journals_2352077693
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ISSN
0957-4522
E-ISSN
1573-482X
DOI
10.1007/s10854-019-02847-z
